lenovo high density server

List of Latest lenovo high density server Models

LENOVO THINKSYSTEM SD665N V3 1U HIGH DENSITY SERVER

Brand: Lenovo
Server Product Name : ThinkSystem SD665N V3 Server
Frame Factor: Full-wide 1U tray; 1 node+GPUs per tray
Chassis: DW612S Enclosure (6U)
Processor: 1x or 2x 4th Generation AMD EPYC Processors per node
RAM : Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray
I/O Expansion: NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O
Acceleration: NVIDIA HGX H100 4-GPU with 4x NVLink connected SXM5 GPUs
Storage: Up to 2x 2.5 NVMe SSDs (7mm height) or 1x 2.5 NVMe SSDs (15mm height) per node, Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
RAID Support: OS Software RAID
Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
Front access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
Rear access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy
Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature
OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

LENOVO THINKSYSTEM SD650N V3 1U HIGH DENSITY SERVER

Brand: Lenovo
Server Product Name : ThinkSystem SD650N V3 Server
Frame Factor: Full-wide 1U tray; 1 node+GPUs per tray
Chassis: DW612S Enclosure (6U)
Processor: Two 5th Gen Intel Xeon Scalable processors per tray, or 2x Intel Xeon CPU Max Series processors per tray
RAM: Up to 2TB using 16x 128GB 5600MHz TruDDR5 RDIMM slots per tray
I/O Expansion: NVIDIA ConnectX-7 4-chip VPI PCIe Gen5 Mezz Board for GPUdirect I/O
Acceleration: NVIDIA HGX H100 4-GPU with 4x NVLink connected SXM5 GPUs
Storage: Up to 2x 2.5 NVMe SSDs (7mm height) or 1x 2.5 NVMe SSDs (15mm height) per node, Up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
RAID Support: OS Software RAID
Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
Front Access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
Rear Access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium) Supports up to N+1 redundancy
Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature
OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit: lenovopress.com/osig for more information.
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

LENOVO THINKSYSTEM SD665 V3 1U HIGH DENSITY SERVER

Brand: Lenovo
Server Product Name : ThinkSystem SD665 V3 Server
Frame Factor: Full-wide 1U tray; 2 nodes per tray
Chassis: DW612S Enclosure (6U)
Processors: 2x 4th Generation AMD EPYC Processors per node
RAM: Up to 3.0TB using 24x 128GB 4800 MHz TruDDR5 RDIMM slots per tray
I/O Expansion: Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported.
Internal Storage: Up to 4x 2.5-inch NVMe SSDs (7mm height) or 2x 2.5-inch NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
RAID Support: OS Software RAID
Network Interfaces: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
Front Access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
Rear Access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
Power Supply: Up to 9x hot-swap air-cooled power supplies (2400W Platinum, 2600W Titanium), or Up to 3x hot-swap direct-water-cooled power supplies (7200W Titanium)Supports up to N+1 redundancy
Cooling Design: Direct Water Cooling at the heat source with up to 50C inlet water temperature
OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

LENOVO THINKSYSTEM SD650I V3 6U HIGH DENSITY SERVER

Brand: Lenovo
Server Product Name : ThinkSystem SD650I V3 High Density Server
Frame Factor/Height: 6U rack-mount with 6 trays
Processor: 2x 4th Gen Intel Xeon Scalable processors per tray or 2x Intel Xeon CPU Max processors per tray
Ram: Up to 2.0TB using 16x 128GB 4800 MHz TruDDR5 RDIMMs per tray
Storage: Up to 4x 7mm or 2x 15mm U.2/SATA, no drive/backplane choice and 1 x liquid cooled M.2 NVMe SSD, providing both the boot drive and storage function SW RAID and Intel VROC for Intel drives only
NIC: 2 x SFP28 25Gb LOM, NCSI (10Gb capable); 1x RJ45 1GbE, NCSI
PCIe: 2x x16 PCIe Gen5 LP per tray
Power Supply: Up to 9x air CFF v4 (2400W PT, 2600W TT); Up to 3x Direct Water Cooled Power Supply (7200W) 80+ Titanium
Cooling System: Direct Water Cooling with up to 50C inlet water temperature
Management: Lenovo XClarity Controller (XCC) and Lenovo Intelligent Computing Orchestration (LiCO)
OS Support: Red Hat Enterprise Linux, SUSE Linux Enterprise Server
Acceleration: Four Intel Data Center GPU Max <=600W TDP
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

LENOVO THINKSYSTEM SD650 V3 HIGH DENSITY SERVER

Brand: Lenovo
Server Product Name : ThinkSystem SD650 V3 High-Density Server
Frame Factor: Full-wide 1U tray (two SD650 V3 nodes per tray, six per DW612S Enclosure)
Chassis: DW612S Enclosure (6U)
Processors: Two 4th Gen Intel Xeon Scalable processors per node, or 2x 4th Gen Intel Xeon CPU Max series processors with HBM per node; 2x nodes per 1U tray
RAM : Up to 2.0TB using 16x 128GB 4800 MHz per node
I/O Expansion: Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported.
Internal Storage: Up to 4x 2.5 SATA/NVMe SSDs (7mm height) or 2x 2.5 NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions
RAID Support: Onboard SATA controller with SW RAID or Intel VROC
Network Interface: Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)
Power Management: Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)
Systems Management: Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements
Front access: All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.
Rear access: 2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection
Power Supply: Up to 9x air CFF v4 (2400W PT, 2600W TT) ; Up to 3x Direct Water Cooled Power Supply (7200W) 80+ Titanium; N+1 redundancy (only air-cooled / without acceleration on DWC)
Cooling Design: Direct Water Cooling at the heat source with up to 45C inlet water temperature
OS Support: Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

LENOVO THINKSYSTEM SD650N V2 HIGH DENSITY SERVER

Brand: Lenovo
Server Product Name : ThinkSystem SD650N V2 High Density Server
Frame Factor/Height: 6U rack-mount with 6 trays
Processor: 2x 3rd Gen Intel Xeon Scalable processors per node
Memory: Up to 2.0TB using 16x 128GB 3200MHz TruDDR4 RDIMMs per tray
Storage: 2x 2.5-inch slim SATA / NVMe U.2 SSD and 2x M.2 SATA SSD SW RAID and Intel VROC for Intel drives only
NIC: 1x SFP28 25Gb LOM, NCSI 1x RJ45 1GbE, NCSI
PCIe: 2x x16 PCIe Gen4 LP per tray
Power Supply: 6/9 N+1 redundant hot-swap PSUs (up to 2400W Platinum)
Cooling System: Direct Water Cooling with up to 50C inlet water temperature
Management: Lenovo XClarity Controller (XCC) and Lenovo Intelligent Computing Orchestration (LiCO)
OS Support: Red Hat Enterprise Linux, SUSE Linux Enterprise Server Tested on CentOS
Acceleration: NVIDIA HGX A100 4-GPU with 4x NVLink connected SXM4 GPUs
Warranty: 3 year CRU & Onsite 9x5 Next Business Day (NBD)

NEXTSCALE SYSTEM M5 WCT

Achieve Scale & Lower Operating Costs

Highly efficient water cooling
Near-silent data center operation
Continuously operate in turbo mode
Enhanced density, no performance sacrifice
Substantial savings in power and cooling costs

Features

Highlights

Achieve scale while lowering your operating expense and raising your performance.
Reach peak performance by operating continuously in turbo mode.
Greater energy efficiency across the data center.
Reduce nearly all data center noise by eliminating system cooling fans.
Drive faster payback by repurposing system heated water elsewhere in your facility.
Significantly enhance density while helping to lower power and cooling costs—without sacrificing performance.

Scalable, Powerful, Dense

Lenovo NeXtScale System addresses the increasing data and computing challenges of the data center by delivering dense performance across a variety of functions—from compute, I/O, storage and acceleration—in more cost- and energy-efficient ways than ever before. NeXtScale System now provides even greater performance, efficiency and flexibility with a choice of air-cooled or water-cooled offerings.

Strong Foundation

Included as a key part of the Lenovo server family, the space-saving NeXtScale System comprises powerful compute, storage and acceleration nodes in an energy-efficient, low-cost 6-bay enclosure.

DISTRIBUTED STORAGE SOLUTION FOR IBM SPECTRUM SCALE

Scalable solution for HPC, analytics & cloud storage

Complex solutions made simple
Advanced technology, optimized solution
Maximize uptime with quick disk rebuild
End-to-end solutions, end-to-end support

Features

Storage at scale

Keeping up with storage demands for High Performance Computing (HPC), Analytics, and Cloud can place a significant burden on IT.
Lenovo Distributed Storage Solution for IBM Spectrum Scale (DSS-G) provides a modular approach to scaling storage capacity and performance, reducing the effort needed to deploy and expand the environment. Clients can focus their efforts on maximizing business value instead of consuming valuable resources to design, optimize, install, and support the infrastructure required to meet business demands.

Optimized design

Lenovo DSS-G features industry-leading Lenovo servers with powerful Intel Xeon processor Scalable family CPUs, Lenovo 12Gbps SAS storage enclosures and drives, software, and networking components that allow for a wide choice of technology within an integrated solution, available in a preintegrated rack or deployed in a customer rack. With DSS-G, high-storage density and I/O performance, you gain all the reliability, integration and interoperability of a high-capacity Spectrum Scale-based storage architecture.

LENOVO SCALABLE INFRASTRUCTURE

Customized, integrated HPC and AI solutions

Optimized for reliability, interoperability, and maximum performance
Industry-best technology
Increased automation and built-in intelligence
End-to-end solutions with end-to-end support

Features

Solutions made simple

Lenovo Scalable Infrastructure (LeSI) is a fulfillment framework for designing, manufacturing, integrating, and delivering data center solutions, with a focus on high performance computing (HPC) and Artificial Intelligence (AI) environments.
Using best-recipe interoperability validation, rack-level testing and factory integration, Lenovo delivers innovative, tailored, and fully supported solutions. This enables clients to focus on maximizing time to production and delivering business value.

Solutions support

LeSI includes a three-year warranty and offers solution level interoperability support while under warranty/maintenance. Interoperability support is based on a "best recipe" release of software and firmware levels that Lenovo warrants to work seamlessly together as a data center solution.
Warranty services upgrades and post-warranty upgrades are available to ensure uninterrupted coverage to match the planned life of your system. Lenovo offers a wide range of flexible warranty maintenance upgrades and post-warranty maintenance agreements.

Lenovo Services

Lenovo offers a comprehensive portfolio of services designed to support the IT lifecycle of your Lenovo assets, to fully address your deployment needs, including:

Lenovo deployment services:

Basic hardware installation

Customized HPC deployment services

Lenovo data center infrastructure services:

Data center best practices workshop
Assessment of the thermal and electrical health of your data center
Planning for power, cooling, and enery efficiency
Installation services

In addition, Lenovo can provide Premium and Managed Support Services.

LENOVO THINKSYSTEM SD530

The density of blades, the economics of rack systems

Modular I/O shuttle design
Supports HPC and enterprise workloads
Superior storage performance
Add-on tray supports two GPUs per node
XClarity Management

Features

Highlights

Ultra-dense 2U, 4-node platform delivers more in less space
Extreme compute capability, ready to adapt when you are
Ultra-agile shuttle design provides the modularity to transform

Ready for what's next

Easily adjusting to new environments and different conditions has been the dictionary definition of adaptability. Now, Lenovo ThinkSystem SD530 redefines IT adaptability. SD530 is a single platform designed to excel not only at critical enterprise workload environments (such as virtualization, hyperconverged infrastructure, and cloud), but also at high performance computing (HPC) and artificial intelligence (AI). Combining the efficiency and density of blades with the value and simplicity of rack-based servers, SD530 could very well be the most adaptable server on Earth.
ThinkSystem SD530 consists of a modular 2U Lenovo D2 Enclosure containing up to four front-access SD530 servers (nodes). Each node, incorporating two powerful Intel® Xeon® processor Scalable family CPUs, achieves up to 56 percent faster performance than the previous generation. The innovative design of the D2 enclosure provides the flexibility to meet varied needs in the modern data center. For example, multiple D2 Enclosures can be easily daisy-chained together and then managed as a single unit, which reduces cabling costs by as much as 92 percent, compared to the previous generation*, and simplifies administration.

LENOVO THINKSYSTEM SD650 HIGH DENSITY SERVER

Direct water cooling for a highly efficient data center

Delivers greater performance than aircooled servers
Provides greater rack and data center density than air-cooled servers
Dramatically reduces energy costs
Supports high-speed EDR IB and Omni Path fabrics
Supports standard SSDs, NVMe SSDs, and M.2 boot SSDs, for even greater storage flexibility

Features

Highlights

Direct water cooling design removes up to 90% of server heat from the rack, keeping processors up to 20°C cooler. This enables the processors to continually run in "turbo" mode, greatly increasing system performance.
Uses incoming (inlet) water for cooling, reducing or eliminating the need for expensive data center evaporative chillers. This saves both equipment costs and footprint space.
Exiting (outlet) water can be used to heat campus buildings to reduce overall energy use, saving you even more on energy costs.

Innovative design

The Lenovo ThinkSystem SD650 dual-node tray is designed for high performance computing (HPC), large-scale cloud, and heavy simulations. It supports workloads from technical computing to grid deployments to analytics and is ideally suited for fields such as research, oil and gas, and engineering. The SD650's unique water-cooling technology provides many key benefits. Compared to other technology, the SD650's direct water cooling:

Reduces data center energy costs by 40%
Increases system performance
Delivers 90% heat removal efficiency*
Creates a quieter data center
Enables data center growth without adding CRACs

Maximum performance and management

Designed to run the highest core-count Intel Xeon Scalable Family processors, the SD650 powers through demanding HPC workloads. Because water cooling removes more heat, CPUs can run in “turbo” mode nonstop, getting up to 10% greater performance from the CPU. For even greater system performance, the SD650 uses 2667MHz DDR4 memory and supports NVMe storage, high-speed EDR InfiniBand, and Omni Path adapters.
The SD650 is managed by Lenovo Intelligent Computing Orchestrator (LiCO), a powerful management suite with an intuitive GUI that helps to easily manage large HPC cluster resources and accelerate development of AI applications.